Thermal Interface Materials are used on FPCB chips to diffuse heat evenly and prevent damage from overheating.
Name | TEL | |
---|---|---|
Jin Hyuk Jang | +82-2-2152-2374 | jhjang@hansol.com |
Jun Heon Kim | +82-2-2152-2373 | jhkim3@hansol.com |
James Sim | +82-2-2152-2371 | jbsim@hansol.com |