메뉴 바로가기 본문내용 바로가기 주메뉴 바로가기 하단 바로가기
ThermalInterfaceMaterials(T.I.M.), Introduction of Hansol Chemical Thermal Interface Materials(T.I.M.)
Product Inquires Data Sheets

Thermal Interface Materials are used on FPCB chips to diffuse heat evenly and prevent damage from overheating.

Characteristics

  • 1. High curing rate
  • 2. ROHS compliant
  • 3. Halogen free
image about Thermal Interface Materials

Contact

담당자 연락처 정보
Name TEL EMAIL
Jin Hyuk Jang +82-2-2152-2374 jhjang@hansol.com
Jun Heon Kim +82-2-2152-2373 jhkim3@hansol.com
James Sim +82-2-2152-2371 jbsim@hansol.com
페이지 맨 위로 이동